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AI computing power enters the era of megawatt-scale liquid cooling: CDU circulating pumps are upgraded to dual-pump redundancy, low leakage, and intelligent variable frequency

2026-09-08 19:19:30 71 江苏海珐

AI Factory, GB300 NVL72, and high-density intelligent computing clusters continue to drive up per-rack power density. Direct-to-Chip cold plate liquid cooling, megawatt-class CDUs, and Secondary Cooling Loops are becoming the new infrastructure for data centers. In 2026, the focus has shifted from "whether to adopt liquid cooling" to 2MW-class CDUs, dual-pump redundancy, VFD variable frequency drives, rapid fault failover, low differential pressure fluctuation, and Coolant Compatibility. ZTE's publicly disclosed solutions show that high-density intelligent computing CDUs are strengthening dual-pump redundancy with sub-second failover; Supermicro also applies VFD and redundant pumps to its AI/HPC liquid cooling systems Jiangsu Haifa Machinery Manufacturing Co., Ltd. (.jslgpump.com) offers low-vibration centrifugal pumps and API 685 sealless magnetic drive pump technical solutions for CDU secondary-side loops, cold plate liquid cooling, and special coolant circulation conditions. For conventional water/glycol and propylene glycol loops, the focus is on optimizing continuous operation, N+1 Pump Redund, low noise, and frequency energy efficiency; for high-purity, low-leakage, or special media applications, magnetic-drive sealless solutions can be evaluated, combined with Leak Detection, Predictive Maintenance, and CDU Pump technologies to enhance 7×24 operational reliability of AI data centers. References: 1. ZTE, "CDU Solutions for High-Density Intelligent Computing Data Centers," 6-08-27, proposing the development of high-density racks toward 240kW/Rack and the MW-class CDU trend. 2. Supermicro liquid-cooled server solutions, publicly disclosing 1.8MW row-level CDU, redundant pump, and VFD architectures. 3. LG Electronics, 2026-07-27, kW CDU validated through NVIDIA AI Infrastructure Validation. 4. NVIDIA GB300 NVL72, adopting liquid-cooled Rack-Scale Architecture. 5. Open Compute Project, Coolant Distribution Unit Sub-Project, advancing standardization of Advanced Cooling Solutions.6. Reuters, 6-09-01 reporting that global AI data center expansion is simultaneously driving up demand for liquid cooling and power infrastructure.


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